JPS6355527A - 液晶表示装置の製造方法 - Google Patents
液晶表示装置の製造方法Info
- Publication number
- JPS6355527A JPS6355527A JP19923586A JP19923586A JPS6355527A JP S6355527 A JPS6355527 A JP S6355527A JP 19923586 A JP19923586 A JP 19923586A JP 19923586 A JP19923586 A JP 19923586A JP S6355527 A JPS6355527 A JP S6355527A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- display panel
- circuit board
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011859 microparticle Substances 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920006332 epoxy adhesive Polymers 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000010419 fine particle Substances 0.000 claims 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 6
- 229910052738 indium Inorganic materials 0.000 abstract description 2
- 238000003848 UV Light-Curing Methods 0.000 abstract 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 1
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 229920002379 silicone rubber Polymers 0.000 description 6
- 239000004945 silicone rubber Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19923586A JPS6355527A (ja) | 1986-08-25 | 1986-08-25 | 液晶表示装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19923586A JPS6355527A (ja) | 1986-08-25 | 1986-08-25 | 液晶表示装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6355527A true JPS6355527A (ja) | 1988-03-10 |
| JPH0577048B2 JPH0577048B2 (en]) | 1993-10-25 |
Family
ID=16404405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19923586A Granted JPS6355527A (ja) | 1986-08-25 | 1986-08-25 | 液晶表示装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355527A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5034245A (en) * | 1989-03-01 | 1991-07-23 | Sharp Kabushiki Kaisha | Method of producing connection electrodes |
| DE4242408A1 (en) * | 1991-12-11 | 1993-06-17 | Mitsubishi Electric Corp | Connecting liquid crystal displays to IC substrate - using patterned conducting photoresist and UV hardened resin to prevent electrodes from being short-circuited |
| EP0884782A1 (en) * | 1996-06-10 | 1998-12-16 | Motorola, Inc. | Integrated electro-optical package and method of fabrication |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225828A (ja) * | 1984-04-24 | 1985-11-11 | Seiko Epson Corp | 液晶パネルの実装方法 |
-
1986
- 1986-08-25 JP JP19923586A patent/JPS6355527A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225828A (ja) * | 1984-04-24 | 1985-11-11 | Seiko Epson Corp | 液晶パネルの実装方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5034245A (en) * | 1989-03-01 | 1991-07-23 | Sharp Kabushiki Kaisha | Method of producing connection electrodes |
| DE4242408A1 (en) * | 1991-12-11 | 1993-06-17 | Mitsubishi Electric Corp | Connecting liquid crystal displays to IC substrate - using patterned conducting photoresist and UV hardened resin to prevent electrodes from being short-circuited |
| DE4242408C2 (de) * | 1991-12-11 | 1998-02-26 | Mitsubishi Electric Corp | Verfahren zum Verbinden eines Schaltkreissubstrates mit einem Halbleiterteil |
| EP0884782A1 (en) * | 1996-06-10 | 1998-12-16 | Motorola, Inc. | Integrated electro-optical package and method of fabrication |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0577048B2 (en]) | 1993-10-25 |
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